JPS6255108B2 - - Google Patents
Info
- Publication number
- JPS6255108B2 JPS6255108B2 JP7503681A JP7503681A JPS6255108B2 JP S6255108 B2 JPS6255108 B2 JP S6255108B2 JP 7503681 A JP7503681 A JP 7503681A JP 7503681 A JP7503681 A JP 7503681A JP S6255108 B2 JPS6255108 B2 JP S6255108B2
- Authority
- JP
- Japan
- Prior art keywords
- attached
- tension
- holding member
- coil
- pointer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 claims description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 230000005284 excitation Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- 229910002844 PtNi Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/10—Arrangements of bearings
- G01R1/12—Arrangements of bearings of strip or wire bearings
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7503681A JPS57190269A (en) | 1981-05-20 | 1981-05-20 | Mounting of mobile parts for tension belt type measuring instrument |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7503681A JPS57190269A (en) | 1981-05-20 | 1981-05-20 | Mounting of mobile parts for tension belt type measuring instrument |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57190269A JPS57190269A (en) | 1982-11-22 |
| JPS6255108B2 true JPS6255108B2 (en]) | 1987-11-18 |
Family
ID=13564564
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7503681A Granted JPS57190269A (en) | 1981-05-20 | 1981-05-20 | Mounting of mobile parts for tension belt type measuring instrument |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57190269A (en]) |
-
1981
- 1981-05-20 JP JP7503681A patent/JPS57190269A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57190269A (en) | 1982-11-22 |
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